High heat resistance multi-layer circuit board materials HIPER E | R-1755E

High heat resistance multi-layer circuit board materials HIPER E

 

  1. Realizes excellent reliability in-vehicle engine rooms: Good through-hole reliability & excellent CAF resistance
  2. High heat resistance Td: 370°C
  3. Compatible with lead-free soldering, excellent laminate processability

Product features

High heat resistance multi-layer circuit board materials HIPER E

HIPER E
  • Laminate R-1755E Prepreg R-1650E

For automotive components

Automotive components(Engine room ECU), Electronic devices that require high reliability(use of lead-free solder), etc.

Through-hole reliability

Through-hole reliability

CAF resistance

CAF resistance

General properties

Item Test method Condition Unit HIPER E
R-1755E
Conventional
FR-4
R-1766
Glass transition temp (Tg) DSC A °C 133 140
Thermal decomposition temp (Td) TG/DTA A °C 370 315
CTE x-axis α1 IPC TM-650 2.4.41 A ppm/°C 11-13 11-13
CTE y-axis 13-15 13-15
CTE z-axis α1 IPC TM-650 2.4.24 A 42 65
α2 250 270
T288 (with copper) IPC TM-650 2.4.24.1 A min 25 1
Dielectric constant (Dk) 1GHz IPC TM-650 2.5.5.9 C-24/23/50 4.6 4.3
Dissipation factor (Df) 0.013 0.016
Water absorption IPC TM-650 2.6.2.1 D-24/23 % 0.11 0.14
Flexural modulus Warp JIS C6481 A GPa 24 23
Fill 22 21
Peel strength 1oz IPC TM-650 2.4.8 A kN/m 1.6 2.0

The sample thickness is 0.8mm.

The above data are typical values and not guaranteed values.