- Low CTE reduces warping and addresses a critical challenge with the IC packaging process.
- Flexibility and buffering features through a stress relaxation technology improves the reliability of the assembly process.
- Offering excellent thickness tolerances.
Circuit Board Materials
- Part Number
Low CTE glass cloth
Laminate R-1515V
Normal glass cloth
Laminate R-1515K
- Application
- Detailed use
・Package
IC substrate FC-BGA (CPU, GPU, FPGA, ASIC, etc.)
Press Release
- 2021-06-22性能优异的高可靠性半导体封装基板材料实现产品化
Properties
CTE x, y-axis 3-5ppm/°C
(Low CTE glass cloth)
(Low CTE glass cloth)
Stress Relaxation
Good Thickness Variation
IC Package Warpage
A wide range of Thickness Line-up
Designed to Improve Reliability
General properties
| Item | Test method | Condition | Unit | R-1515V Low CTE glass cloth |
R-1515K Normal glass cloth |
Conventional Normal glass cloth |
|
|---|---|---|---|---|---|---|---|
| Glass transition temp.(Tg) | DMA*2 | A | °C | 260 | 260 | 260 | |
| CTE x-axis | α1 | TMA*2 | A | ppm/°C | 3-5 | 7 | 8-10 |
| CTE y-axis | 3-5 | 7 | 8-10 | ||||
| Dielectric constant(Dk)*1 | 1GHz | IPC-TM-650 2.5.5.9 | C-24/23/50 | – | 4.4 | 4.6 | 4.8 |
| Dissipation factor(Df)*1 | 0.016 | 0.015 | 0.015 | ||||
| Elastic modulus*1 | IPC-TM-650 2.4.4*3 | 25°C | GPa | 30 | 27 | 33 | |
| 250°C | 14 | 12 | 21 | ||||
The sample thickness is 100µm.
*1 700µm
*2 Measurement in tensile mode.
*3 The IPC standard determines the test sample size, methods and conditions, etc.
but there is no formula for calculating the elastic modulus.
Therefore, we quantified it according to JIS C 6481.
Our Halogen-free materials are based on JPCA-ES-01-2003 standard and others.
Contain; Chlorine:≤0.09wt%(900ppm), Bromine:≤0.09wt%(900ppm),
Chlorine+Bromine:≤0.15wt%(1500ppm)
The above data are typical values and not guaranteed values.
